Patent Application Number: 2005289781
Filing Date: September 21, 2005Priority Date: September 28, 2004
Inventors: S. Jonathan Wang, Terry E. McMahon, Gregory T. Hindman, Dennis W. Tom, Simon Dodd, Frank R. Bryant, Richard Todd Miller
Applicants: Hewlett-Packard Development Company, L.P.
View Prior Art for Claim 5
The semiconductor structure of claim 1 wherein the second conductive material comprises a resistive portion and a conductive portion disposed upon the resistive portion.
United States