Patent Application Number: 2005289781
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| Summary / Description | A structure and method for fabricating the structure, which includes a layer containing a refractory metal and a substrate to which the refractory metal-containing layer does not strongly adhere, there being a thin bonding layer between the substrate and the refractory metal-containing layer for providing good adherence between the refractory metal-containing layer and the substrate. |
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| Type of Prior Art | Issued Patents - US |
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| Country | United States of America |
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| Patent/Application # | 4732801 |
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| Kind Code | United States (US) - United STATES Patent - A |
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| Patentee Name | International Business Machines Corporation |
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| Relevant Pages, Columns, or Lines | See at least fig 1 and col 4, |
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| URL | |
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| Filing Date | March 22, 1998 |
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| Additional Information | NB - Above date is ISSUE DATE not FILING DATE. |
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Excerpt Submitted by S. Murray on behalf of Rajiv Joshi |
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Claims
A semiconductor structure, comprising: a substrate comprising a first surface; a first insulative material disposed on at least a portion of the first surface, the first insulative material comprising a plurality of openings forming a path to the first surface; a first conductive material disposed on the first insulative material, the first conductive material being disposed so that the plurality of openings are substantially free of the first conductive material; a second insulative material disposed on the first conductive material and portions of the first insulative material, the second insulative material being disposed so that the plurality of openings are substantially free of the second insulative material; and a second conductive material being disposed on second insulative material and within plurality of openings so that some of the second conductive material disposed upon the second insulative material is in electrical contact with the substrate.
| Relevance | see at least fig 1 and col 4, lines 16-54 |
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United States